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Aware (Booth #14046) introduces StratiPHY-Bond, a loop bonding technology that provides the telecom industry with a revolutionary technique for combining multiple ADSL2+ connections together into a single, aggregated connection, even if they have different capacities.

Aware's StratiPHY-Bond is targeted to semiconductor manufacturers building ICs for standard-compliant ITU G.bond-ATM customer premises equipment. StratiPHY-Bond is a complete instantiation of the ITU-bonded standard and consists of bonding logic and management software to support two-pair bonding of ADSL2+ lines. By using Aware's StratiPHY-Bond technology in its network equipment, service providers can leverage their existing copper infrastructure to roll out video offerings faster and for less money than by using alternative technologies such as fiber to the home.

StratiPHY-Bond meets the evolving business needs of Aware's customers. The increased consumer demand for video-over-DSL has service providers looking for a solution from equipment manufacturers, and equipment manufacturers look to the chip companies for standard-compliant solutions. Aware has been developing bonded technology for several years, substantially contributed to the ITU standard for bonding and recently published a white paper titled "Bonded ADSL2+: New Standards for Multi-Line Services."

Aware will showcase StratiPHY-Bond at the Telecommunications Top 10 Technologies Pavilion and also in its booth #14046.

www.aware.com